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COG compatible flip chip bonder Product List

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COF/COG compatible flip chip bonder

COF/COG compatible flip chip bonder

Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.

Full automation is possible at a low cost through integration with the conveying system.

  • Bonding Equipment
  • Other semiconductor manufacturing equipment
  • COG compatible flip chip bonder

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